Electrical performance of electronic packaging October 22-31, 2001, Royal Sonesta Hotel, Cambridge, Massachusetts by Topical Meeting on Electrical Performance of Electronic Packaging (10th 2001 Cambridge, Mass.)

Cover of: Electrical performance of electronic packaging | Topical Meeting on Electrical Performance of Electronic Packaging (10th 2001 Cambridge, Mass.)

Published by IEEE in Piscataway, New Jersey .

Written in English

Read online

Subjects:

  • Electronic packaging -- Congresses,
  • Materials -- Electric properties -- Congresses

Edition Notes

Book details

Other titlesIEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging.
Statementsponsored by the IEEE Microwave Theory and Techniques Society and the IEEE Components, Packaging and Manufacturing Technology Society.
GenreCongresses.
ContributionsIEEE Microwave Theory and Techniques Society., Components, Packaging & Manufacturing Technology Society.
The Physical Object
Paginationxi, [345] p. :
Number of Pages345
ID Numbers
Open LibraryOL17619222M
ISBN 100780370244
LC Control Number2001087980
OCLC/WorldCa48500430

Download Electrical performance of electronic packaging

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play.

Thermal considerations at both the device and the systems level are also Electronic Packaging Handbook, a new volume 5/5(2). EPEPS Conference OctoberEPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems.

It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. Get this from a library. Electrical performance of electronic packaging: October, the Hotel Thayer, West Point, New York.

[IEEE Microwave Theory and Techniques Society.; Components, Packaging & Manufacturing Technology Society.;]. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost.

In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and by: Get this from a library. Electrical performance of electronic packaging: October, Radisson Resort & Spa Scottsdale, Scottsdale, Arizona.

[IEEE Microwave Theory and Techniques Society.; Components, Packaging & Manufacturing Technology Society.;]. The main objectives of electronic packaging are (a) the protection of the IC chip (or die) and (b) the interconnection of IC chips to other electronic components (i.e., IC chips, printed circuit boards (PCBs), transformers, and connectors) for transfer of electrical signals.

An electronic package may be designed to •. This book is a highly recommended reference for all mechanical (and, I suppose, some electrical) engineers working on packaging. The book covers many topics with enough detail so that the engineer may have a good holistic understanding of everything from: pcb design, layout and fabrication - component fundamentals including IC's - EMC issues - interconnect issues - reliability - testing/5(2).

Call for Papers. For a PDF version of the call for papers, please click here. EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems.

Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

Check out Conference on Electrical Performance of Electronic Packaging and Systems DoubleTree by Hilton Hotel San Jose Dates Location Schedule Registration Agenda Reviews Exhibitor list. A 4 days conference, Conference on Electrical Performance of Electronic Packaging and Systems is going to be held in San Jose, USA from 04 Oct to 07 Oct focusing on Electronics & Electrical.

ECE Design of Electronic Packaging and Interconnects. packaging technology selection, electrical performance of packaging, thermal design, electrical design of printed circuit boards, backplane and multichip module interconnect, receiver and driver selection, EMI control, CAD tools, and measurement issues.

All exams are closed-book. IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) San Jose, CA USA Oct 4, - Oct 7, 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Taipei, Taiwan - Intel's Packaging Databook Chapter 4: IC Packages Performance Characteristics: Packaging As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which provides protection for the die from the outside environment to that of an electrical interconnect that affects.

Abstract. Chapter 1 introduces the background of this book. It covers the historical evolution and basic performance metrics of IC packaging. The challenges from electrical, thermal and mechanical viewpoints are highlighted and possible solutions with design and. EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems.

It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. 2 POLYMERS FOR ELECTRONICS PACKAGING AND INTERCONNECTION important to address the role of polymers in electronic packaging and interconnection. The symposium and this book have enabled us to assemble the results of research by experts in polyimides and related materials, polymeric encapsulants, gels, and printed wiring board (PWB).

Electronic Packaging Materials and their Properties Article (PDF Available) in IEEE Electrical Insulation Magazine 17(5) - 60 October with 1, Reads How we measure 'reads'. Check out Conference on Electrical Performance of Electronic Packages and Systems DoubleTree by Hilton Hotel San Jose Dates Location Schedule Registration Agenda Reviews Exhibitor list.

A 4 days conference, Conference on Electrical Performance of Electronic Packages and Systems is going to be held in San Jose, USA from 04 Oct to 07 Oct focusing on Packaging product categories.

In this paper, preliminary work on electrical performance estimation and evaluation for multi-chip assemblies (i.e., multi-chip modules, chip on board, and etc.) is presented. A knowledge base is built to facilitate system performance merits evaluation process.

These packaging schemes are crucial to the overall reliability and performance of electronic ts of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectorsAddresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists 5/5(1).

Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe ing of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic t safety standards may dictate particular features of.

Electronic materials and processes handbook, 3rd edition [Book Review] Article (PDF Available) in IEEE Electrical Insulation Magazine 20(5) 46 October with 2, Reads.

Develop advanced packaging technologies for wide bandgap (WBG) power electronics: Advancing automotive power modules and power converters in electrical performance, cooling capability, thermomechanical performance, and manufacturability, resulting in - comprehensive improvement in cost-effectiveness, efficiency, reliability and power density of.

Advanced Multi-physics Simulation for High Performance Power Electronic Packaging Design. Xin Zhao, Yang Xu, Douglas C. Hopkins. Department of Electrical and Computer Engineering. North Carolina State University. Raleigh, USA. [email protected], [email protected], [email protected] Abstract — Power electronics packaging is required by.

Sponsor: IEEE Electronics Packaging Society. Presented to: An individual or a team of not more than three. Scope: For meritorious contributions to the advancement of components, electronic packaging, or manufacturing technologies. Prize: The award consists of a bronze medal, certificate, and honorarium.

About the Journal. The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips.

These packaging schemes are crucial to the overall reliability and performance of electronic systems. Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly.

Book Description. The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play.

Many of the formal technical publications of the NASA Glenn Smart Sensors and Electronics Systems Branch are listed in the below table. These technical publications are posted on this site in order to ensure timely public dissemination of NASA technical work.

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and : $ Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost.

In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture.

Madhavan Swaminathan is the John Pippin Chair in Electromagnetics in the School of Electrical and Computer Engineering (ECE) and Director of the 3D Systems Packaging Research Center (PRC) at Georgia Tech. He formerly held the position of Joseph M. Pettit Professor in Electronics in ECE and Deputy Director of the NSF Microsystems Packaging Research Center, Georgia Tech.

Prior. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit the integrated circuit industry, the.

electronic materials handbook packaging volume i is packed with valuable instructions, information and warnings. We also have many ebooks and user guide is also related with electronic materials of electrical specialty study guide in digital format, so the resources that you find are reliable.

There are also many Ebooks of related with this File Size: 38KB. Advanced electronic packaging materials play a key role in the proper functioning and useful life of the packaged electronic assembly. These functions mainly include electrical conduction, electrical insulation, mechanical support and structural profiles, environmental protection, as well as thermal conduction and by: 2.

The following topics are dealt with: electronic packaging; low power design; fine pitch technology; connectors; distorted serial systems; jitter; amplification; capacitance measurement; dielectric constant; dielectric loss tangent; impedance measurement; power supply system; current measurement; power distribution networks; noise suppression; switching noise; power plane noise; mixed signal.

Oxidation prevention and electrical property enhancements of copper-filled electrically conductive adhesives for electronic packaging and interconnection. In: Proceedings of the 57th Electronics Components and Technology Conference, Reno, NV, May June 1,pp. Packaging Databook Performance Characteristics of IC Packages Capacitances which are important to package electrical performance are “loading” capacitance, “lead-to-lead” capacitance, and “decoupling” capacitance.

The loading capacitance is the total capacitance of a lead with respect to all surrounding Size: KB. Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages.

Electronic packaging provides the in-terconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical andFile Size: 1MB. The Electronic Packaging Handbook - CRC Press Book The packaging of electronic devices and systems represents a significant challenge for product designers and managers.

Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all .The packaging of electronic devices and systems represents a significant challenge for product designers and managers.

Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging, discussing the various electrical adhesive options currently book focuses extensively on Electrically Conductive Adhesives (ECAs), as well as other adhesives such as lead-free soldering, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA.

91118 views Friday, October 23, 2020